Merger of Integrated Circuits and MEMS

Makoto Ishida

At the Toyohashi University of Technology -

Toyohashi University of Technology

Currently a 4-inch CMOS, 1 micron process is possible using

a stepper. In 1994, the department moved to the Electron

Device Research Center from the original building where it was

established, and in 2002 it was incorporated in the VBL

(Venture Business Laboratory) facilities. A clean room where

micro and nano processing is possible was set up on the first

floor of the VBL, and MEMS processing was enhanced. We have

fabricated many kinds of smart chips that merge sensors and

MEMS with integrated circuits, but MEMS manufacture

requires special process other than the CMOS process, so it has

often become necessary to use the equipment separately. How

to organize and manage this is a difficult matter, and success

rests upon being able to adjust for the interests of both. It is

necessary to have a relationship where both can allow

compromise as far as possible. It is also necessary to design

hitherto unknown processes.

Conceptual diagram of a nerve potential

sensor integrating a miniature electrode array

and signal processing circuit, and electron

microscope photograph of a prototype chip